A Review of Thermal Design for IGBT Module

doi:10.11930/j.issn.1004-9649.202007137

Abstract

Abstract: In this paper, the thermal characteristics and thermal design of IGBT module are reviewed. Firstly, the thermal network model and its dependence on the packaging material’s thermal performance and dimensions are addressed. Then, the thermal design of IGBT module is investigated in terms of semiconductor chip, packaging structure and material. Finally, the main thermal design aspects of conventional IGBT module and new press-pack IGBT module are presented.

Key words: IGBT module, thermal design, reliability

LIU Guoyou, WANG Yangang, LUO Haihui, QI Fang, LI Xiang, WU Yibo. A Review of Thermal Design for IGBT Module[J]. Electric Power, 2020, 53(12): 55-61,74.

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URL: https://www.electricpower.com.cn/EN/10.11930/j.issn.1004-9649.202007137

https://www.electricpower.com.cn/EN/Y2020/V53/I12/55

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