Accelerate Aging Test Method for Press-Pack IGBT Power Module

doi:10.11930/j.issn.1004-9649.202108087

Abstract

Abstract: Since reliability test of Press-pack IGBT (PPI) still not been researched enough, based on its application in industry, A cycle aging test methods aimed at VSC-HVDC power unit are proposed. The junction temperature formulas for all test methods are obtained by analyzing promising test waveforms and thermal impedance models under the specific test conditions. Experiments results illustrate measured junction temperature waveforms of PPI that under the aging tests, and proposed methods are validated.

Key words: press-pack IGBT, junction-temperature, cycle aging, thermal-impedance

LI Biaojun, CHU Haiyang, ZHUANG Zhifa, WEN Jun. Accelerate Aging Test Method for Press-Pack IGBT Power Module[J]. Electric Power, 2022, 55(10): 87-91.

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URL: https://www.electricpower.com.cn/EN/10.11930/j.issn.1004-9649.202108087

https://www.electricpower.com.cn/EN/Y2022/V55/I10/87

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